Open AccessCharacterization of the thermosonic wire bonding technique. [Combination of ultrasonic energy and thermocompression]
Author(s) -
David Johnson,
Emigdio ChávezÁngel
Publication year - 1976
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/7353285
Subject(s) - wire bonding , materials science , substrate (aquarium) , thermocompression bonding , ultrasonic sensor , characterization (materials science) , composite material , nanotechnology , computer science , acoustics , layer (electronics) , telecommunications , chip , oceanography , physics , geology
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