Open AccessLow temperature aluminum soldering analysis
Author(s) -
W.G. Peterkort
Publication year - 1976
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - Uncategorized
Resource type - Reports
DOI - 10.2172/7335688
Subject(s) - soldering , metallurgy , materials science , aluminium , flux (metallurgy) , ultimate tensile strength , joint (building) , dihedral angle , composite material , structural engineering , engineering , chemistry , hydrogen bond , organic chemistry , molecule
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