Open AccessEffects of substrate temperature on silicon nitride cracking of beam lead devices during thermocompression wobble bonding
Author(s) -
D. W. Bushmire,
Emigdio ChávezÁngel,
Marcus Finley
Publication year - 1976
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/7273190
Subject(s) - materials science , cracking , silicon nitride , wire bonding , nitride , substrate (aquarium) , silicon , optoelectronics , composite material , metallurgy , electrical engineering , layer (electronics) , chip , oceanography , geology , engineering
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