Open AccessHybrid microcircuit intraconnection processes
Author(s) -
H.B. Bonham
Publication year - 1976
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - Uncategorized
Resource type - Reports
DOI - 10.2172/7262162
Subject(s) - wire bonding , materials science , thermocompression bonding , capacitor , optoelectronics , nanotechnology , mechanical engineering , electrical engineering , voltage , layer (electronics) , engineering , chip
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