Open AccessBond strength of urethane and epoxy-modified adhesives
Author(s) -
F.G. Childress,
A.K. Zava,
C. E. Miller
Publication year - 1976
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/7193527
Subject(s) - epoxy , adhesive , curing (chemistry) , composite material , materials science , yield (engineering) , epoxy adhesive , modulus , layer (electronics)
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom