Open AccessTransfer molding of close-tolerance parts. Final report. [Electronics packaging module]
Author(s) -
B.A. Hegner
Publication year - 1977
Language(s) - Uncategorized
Resource type - Reports
DOI - 10.2172/7091491
Subject(s) - molding (decorative) , mold , materials science , epoxy , transfer molding , process engineering , composite material , electronics , mechanical engineering , engineering drawing , engineering , electrical engineering