Flip Chip Attach (TRP ARPA No. 3327). Quarterly report, January 1, 1995--March 31, 1995 | Zendy

C. G. Woychik | Zendy

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Flip Chip Attach (TRP ARPA No. 3327). Quarterly report, January 1, 1995--March 31, 1995

Author(s) -

C. G. Woychik

Publication year - 1995

Publication title -

osti oai (u.s. department of energy office of scientific and technical information)

Language(s) - English

Resource type - Reports

DOI - 10.2172/70726

Subject(s) - flip chip , stencil , chip , electrical conductor , reliability (semiconductor) , benchmarking , adhesive , materials science , computer science , nanotechnology , telecommunications , composite material , physics , business , power (physics) , computational science , layer (electronics) , quantum mechanics , marketing

IBM Endicott, Assembly Process Design has continued to progress on the ARPA Contract for Conductive Adhesive Flip Chip Attach during the period January 3, 1995 to March 31, 1995 in defining process bonding parameters. An initial test chip design has been defined and ordered. Insights have been gained about stencil printing. Benchmarking reliability tests of flip chip encapsulants continued as well as studies on the thermal conductivity of the electrically conductive adhesive

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