Open AccessUltrasonic examination techniques for multicouple thermoelectric subcomponents and assemblies: Status report
Author(s) -
K.V. Cook,
R.W. McClung,
W. A. Simpson,
R.A. Cunningham
Publication year - 1986
Language(s) - English
Resource type - Reports
DOI - 10.2172/6908715
Subject(s) - modular design , ultrasonic sensor , scalability , thermoelectric generator , computer science , generator (circuit theory) , nondestructive testing , thermoelectric effect , power (physics) , acoustics , physics , programming language , thermodynamics , quantum mechanics , database
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