Open AccessCoupled heat conduction and thermal stress formulation using explicit integration. [LMFBR]
Author(s) -
A.H. Marchertas,
R.F. Kulak
Publication year - 1982
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/6858109
Subject(s) - cracking , thermal conduction , thermal , mechanics , transient (computer programming) , materials science , thermodynamics , computer science , physics , composite material , programming language
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