Open AccessTesting the interlaminate adhesion of multilayer printed wiring boards
Author(s) -
J.W. Lula
Publication year - 1978
Language(s) - English
Resource type - Reports
DOI - 10.2172/6634622
Subject(s) - lamination , printed circuit board , materials science , adhesion , 3d printed , layer (electronics) , composite material , paint adhesion testing , engineering drawing , electrical engineering , biomedical engineering , engineering