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Microstructure-strength relationship of a deformation processed aluminum-titanium composite
Author(s) -
T. Lund
Publication year - 1998
Language(s) - English
Resource type - Reports
DOI - 10.2172/658375
Subject(s) - materials science , microstructure , composite material , composite number , electrical resistivity and conductivity , deformation (meteorology) , texture (cosmology) , image (mathematics) , artificial intelligence , engineering , computer science , electrical engineering
The mechanical properties, electrical properties and microstructures have been evaluated for an Al-20 wt % Ti deformation processed metal metal matrix composite (DMMC). The strength of the swaged, extruded and wire drawn composite increases several-fold with increasing deformation up to a true strain of 12.1, the maximum investigated. At this point the Ti was elongated and SEM and TEM analysis of the transverse direction of the wire showed the ribbon-like filaments that are common for this type of material. Texture development was also characterized to explain the deformation characteristics of the composite materials. The Ti filaments acquired a <10{bar 1}0> fiber texture during deformation, and the Al filaments acquired a dual texture of (111) and (100). Resistivity measurements of the composite showed that for the highest deformed sample ({eta} = 12.1), the resistivity increased linearly with temperature up to the temperature where Al{sub 3}Ti formed. At this point the slope increased. Beyond this point, the resistivity of the sample never returned to its original value. The temperature where Al{sub 3}Ti forms was investigated using DTA and XRD analysis. The reaction temperature decreases with increasing deformation true strain ({eta}) and filament spacing

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