Low-temperature curing of a nitrile-epoxy adhesive. Final report | Zendy

J.S. Tira | Zendy

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Low-temperature curing of a nitrile-epoxy adhesive. Final report

Author(s) -

J.S. Tira

Publication year - 1981

Publication title -

osti oai (u.s. department of energy office of scientific and technical information)

Language(s) - English

Resource type - Reports

DOI - 10.2172/6574057

Subject(s) - adhesive , materials science , composite material , curing (chemistry) , epoxy adhesive , moisture , epoxy , glass transition , polyethylene , polymer , layer (electronics)

Adhesive strength and glass transition temperature were correlated with cure times at 85/sup 0/C and above. The effect of moisture on adhesive cure and strength was tested. With a 3-hour cure at 85/sup 0/C, lap shear strength met specification requirements. The adhesive was found to absorb moisture with time, especially if one or both polyethylene covers are removed. Placing the adhesive in a desiccator for 30 minutes produced excellent room temperature shear strengths. Preconditioning (removal of moisture) is critical for elevated temperature cures.

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