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Deposition of aluminum-copper alloy on laminated polyimide substrates from an RF induction source
Author(s) -
G.J. Hale
Publication year - 1978
Language(s) - English
Resource type - Reports
DOI - 10.2172/6519028
Subject(s) - copper , materials science , aluminium , polyimide , electrical resistivity and conductivity , deposition (geology) , alloy , substrate (aquarium) , chemical vapor deposition , metallurgy , composite material , physical vapor deposition , analytical chemistry (journal) , coating , layer (electronics) , optoelectronics , chemistry , electrical engineering , geology , paleontology , sediment , oceanography , chromatography , engineering

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