Open AccessQuantitative comparison of electronic component-solder joint stress relief in encapsulated assemblies
Author(s) -
D A Cummings
Publication year - 1978
Language(s) - English
Resource type - Reports
DOI - 10.2172/6378241
Subject(s) - soldering , component (thermodynamics) , joint (building) , silicone , materials science , stress (linguistics) , stress relief , electronic component , composite material , electronic packaging , structural engineering , mechanical engineering , engineering , linguistics , philosophy , physics , thermodynamics