Open AccessMoisture absorption and bakeout characteristics of rigid-flexible multilayer printed wiring boards
Author(s) -
J.W. Lula
Publication year - 1991
Language(s) - English
Resource type - Reports
DOI - 10.2172/6176951
Subject(s) - moisture , materials science , composite material , absorption (acoustics) , water content , degree (music) , engineering , physics , geotechnical engineering , acoustics