Metallization of large silicon wafers. Final report
Author(s) -
R. A. Pryor
Publication year - 1979
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/6124217
Subject(s) - palladium , materials science , metallizing , ohmic contact , silicon , wafer , nickel , metallurgy , soldering , tin , plating (geology) , silicide , layer (electronics) , contact resistance , metal , composite material , optoelectronics , chemistry , biochemistry , geophysics , geology , catalysis
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