Open AccessMechanical behavior of an axisymmetric solder joint-component system during encapsulation and thermal cycling. Final report
Author(s) -
D.M. Jarboe
Publication year - 1979
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/5914974
Subject(s) - temperature cycling , soldering , materials science , epoxy , composite material , encapsulation (networking) , thermal , work hardening , copper , metallurgy , computer network , microstructure , physics , meteorology , computer science
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