Open AccessThumb tack physical model evaluation of polystyrene bead foam as an encapsulant for electronic packages
Author(s) -
D.J. Fossey,
G.D. Swanson
Publication year - 1980
Language(s) - English
Resource type - Reports
DOI - 10.2172/5641281
Subject(s) - soldering , materials science , polystyrene , bead , composite material , thumb , electronic component , electronic packaging , metal foam , thermal expansion , polymer , mechanical engineering , medicine , engineering , anatomy , aluminium
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