Open AccessImproving delamination resistance of multilayer printed wiring boards
Author(s) -
J.W. Lula
Publication year - 1980
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/5583045
Subject(s) - materials science , soldering , composite material , delamination (geology) , lamination , oxide , reflow soldering , wave soldering , metallurgy , layer (electronics) , paleontology , biology , subduction , tectonics
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