Open AccessStress relief techniques for reducing thermal fatigue in solder joints
Author(s) -
D.M. Jarboe
Publication year - 1978
Language(s) - English
Resource type - Reports
DOI - 10.2172/5349097
Subject(s) - soldering , silicone , materials science , polyurethane , temperature cycling , composite material , stress (linguistics) , thermal , component (thermodynamics) , stress relief , linguistics , philosophy , physics , meteorology , thermodynamics