Open AccessMoisture penetration evaluation of polystyrene bead foam as an encapsulant for electronic packages
Author(s) -
G.D. Swanson
Publication year - 1980
Language(s) - English
Resource type - Reports
DOI - 10.2172/5347302
Subject(s) - polystyrene , penetration (warfare) , moisture , materials science , impervious surface , composite material , expanded polystyrene , bead , porosity , penetration depth , polymer , optics , ecology , operations research , engineering , biology , physics
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