Open AccessCost of Czochralski wafers as a function of diameter
Author(s) -
M. H. Leipold,
C. C. Radics,
A. H. Kachare
Publication year - 1980
Language(s) - English
Resource type - Reports
DOI - 10.2172/5277178
Subject(s) - ingot , wafer , silicon , materials science , range (aeronautics) , czochralski method , carrier lifetime , production cost , metallurgy , composite material , optoelectronics , mechanical engineering , engineering , alloy
The impact of diameter in the range of 10 to 15 cm on the cost of wafers sliced from Czochralski ingots is analyzed. Increasing silicon waste and decreasing ingot cost with increasing ingot size are estimated along with projected costs. Results indicate a small but continuous decrease in sheet cost with increasing ingot size in this size range. Sheet costs including silicon are projected to be $50 to $60/m/sup 2/ (1980 $) depending upon technique used.
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