Development of XRMF techniques for measurement of multi-layer film thicknesses on semiconductors for VLSI and ULSI integrated circuits. Final CRADA report for CRADA number Y-1292-0130 | Zendy

Douglas A. Carpenter | Zendy; Danilo Golijanin | Zendy; David C. Wherry | Zendy

Open Access

Development of XRMF techniques for measurement of multi-layer film thicknesses on semiconductors for VLSI and ULSI integrated circuits. Final CRADA report for CRADA number Y-1292-0130

Author(s) -

Douglas A. Carpenter,

Danilo Golijanin,

David C. Wherry

Publication year - 1997

Language(s) - English

Resource type - Reports

DOI - 10.2172/527526

Subject(s) - microprobe , instrumentation (computer programming) , materials science , very large scale integration , layer (electronics) , integrated circuit , semiconductor , wafer , electronic circuit , tube (container) , optoelectronics , mechanical engineering , electrical engineering , engineering , composite material , computer science , mineralogy , chemistry , operating system

A CRADA with Kevex Instruments was carried out to develop improved XRMF instrumentation for the nondestructive analysis of electronic components during manufacture. Experiments conducted at Y-12 proved the feasibility of a new Kevex x-ray tube design. Tests also show that the current commercial supply of straight glass capillaries is unreliable; however, other vendors of tapered single and multiple glass capillaries were identified. The stability of the Y-12 x-ray microprobe was significantly enhanced as a result of this CRADA

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