Open AccessCure cycle evaluation for multilayer printed wiring boards
Author(s) -
J.W. Lula
Publication year - 1980
Language(s) - Uncategorized
Resource type - Reports
DOI - 10.2172/5256048
Subject(s) - epoxy , materials science , composite material , delamination (geology) , soldering , printed circuit board , dip soldering , electrical engineering , engineering , wave soldering , paleontology , biology , subduction , tectonics