Open AccessMultilayer printed wiring board lamination
Author(s) -
J.W. Lula
Publication year - 1980
Language(s) - Uncategorized
Resource type - Reports
DOI - 10.2172/5242555
Subject(s) - lamination , delamination (geology) , printed circuit board , materials science , composite material , 3d printed , engineering drawing , electrical engineering , engineering , manufacturing engineering , paleontology , layer (electronics) , biology , subduction , tectonics