Open AccessBond-strength studies for 1-mil-diameter gold wires bonded to hybrid microcircuit substrates
Author(s) -
Yingnan Kan,
Vincent C. Prantil
Publication year - 1981
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/5187025
Subject(s) - wedge (geometry) , structural engineering , bond strength , bond , multiplexer , ball (mathematics) , materials science , mathematics , engineering , composite material , geometry , electrical engineering , multiplexing , adhesive , finance , layer (electronics) , economics
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