Open AccessElastic moduli of boron carbide/copper composites from -40/sup 0/C to 800/sup 0/C by ultrasonic methods
Author(s) -
J.H. Gieske
Publication year - 1980
Language(s) - English
Resource type - Reports
DOI - 10.2172/5027469
Subject(s) - ultrasonic sensor , boron carbide , composite material , materials science , copper , shear modulus , elastic modulus , boron , poisson's ratio , modulus , young's modulus , poisson distribution , metallurgy , chemistry , acoustics , mathematics , physics , statistics , organic chemistry