Open AccessThermal cycling tests on surface-mount assemblies
Author(s) -
C. W. Jennings
Publication year - 1988
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - Uncategorized
Resource type - Reports
DOI - 10.2172/5023426
Subject(s) - materials science , polyimide , temperature cycling , composite material , epoxy , kevlar , soldering , thermal expansion , layer (electronics) , thermal , physics , meteorology
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