DEVELOPMENT OF DIFFUSION-TYPE BONDING TECHNIQUES FOR BERYLCO-25 ALLOY
Author(s) -
G.R. Baxter,
J. A. Hoffman,
R.C. Bertossa,
B.R. Cottrell
Publication year - 1961
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/4763611
Subject(s) - beryllium , copper , materials science , diffusion bonding , precipitation hardening , ultimate tensile strength , metallurgy , brazing , alloy , bond strength , diffusion , precipitation , hardening (computing) , composite material , adhesive , thermodynamics , chemistry , physics , organic chemistry , layer (electronics) , meteorology
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