Open AccessLow temperature thermal expansion of copper, silver, gold and aluminum
Author(s) -
Kent Otho McLean
Publication year - 1969
Language(s) - English
Resource type - Reports
DOI - 10.2172/4737602
Subject(s) - dilatometer , thermal expansion , debye model , copper , shear modulus , materials science , bulk modulus , aggregate modulus , poisson's ratio , elastic modulus , composite material , young's modulus , thermodynamics , poisson distribution , dynamic modulus , metallurgy , dynamic mechanical analysis , physics , mathematics , statistics , polymer
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom