Open AccessMini ball grid array (mBGA) assembly on MCM-L boards
Author(s) -
Rajen Chanchani,
K. Treece,
P. V. Dressendorfer
Publication year - 1997
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/463644
Subject(s) - ball grid array , materials science , flip chip , chip , quad flat no leads package , ceramic , chip scale package , polyimide , conductor , printed circuit board , ball (mathematics) , die (integrated circuit) , grid , integrated circuit , optoelectronics , electrical engineering , interconnection , composite material , engineering , nanotechnology , adhesive , soldering , telecommunications , layer (electronics) , geometry , mathematical analysis , mathematics
Sandia National Laboratories has developed a chip scale packaging technology called mini Ball Grid Array (mBGA). The mBGA is a flip chip die, obtained by redistributing peripheral pads in existing dies to an area array of pads 10 mils or larger in diameter with a minimum pitch of 20 mils. The peripheral pads are redistributed to area array pads using two polyimide dielectric and two metal conductor layers. mBGA can be closely tiled together on a substrate to yield a very high circuit density. In an earlier report, the authors presented the results on the reliability and thermal performance of mBGA on silicon and ceramic substrates. In this report, they present an mBGA cost analysis, improvements in the mBGA bump adhesion, and reliability and thermal performance of mBGA assemblies on FR-4 boards
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