Open AccessMICROBONDING AND PACKAGING FOR HYBRID MICROELECTRONIC CIRCUITS. Final Report.
Author(s) -
B J Driscoll
Publication year - 1971
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/4635650
Subject(s) - microelectronics , electronic circuit , materials science , computer science , nanotechnology , engineering , electrical engineering
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