TESTING FOR MATERIAL FLAWS AND THERMAL DESIGN DEFECTS USING HOLOGRAPHIC INTERFEROMETRY.
Author(s) -
M.C. Collins,
M.P. Schoeppner,
C.E. Watterson
Publication year - 1972
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/4616581
Subject(s) - holography , holographic interferometry , interferometry , materials science , thermal , optics , forensic engineering , engineering , physics , thermodynamics
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