BOND-ADHESION STUDY OF ELECTROLESS NICKEL PLATING ON TYPE 4340 STEEL.
Author(s) -
C. A. Reeves Jr.
Publication year - 1972
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/4591185
Subject(s) - materials science , nickel , plating (geology) , adhesion , metallurgy , electroless plating , electroless nickel plating , composite material , layer (electronics) , electroplating , geology , geophysics
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