Open AccessCVD diamond substrate for microelectronics. Final report
Author(s) -
J. Burden,
R. Gat
Publication year - 1996
Language(s) - English
Resource type - Reports
DOI - 10.2172/436418
Subject(s) - diamond , microelectronics , chemical vapor deposition , lapping , commercialization , polishing , chemical mechanical planarization , abrasive , substrate (aquarium) , materials science , nanotechnology , manufacturing engineering , engineering , mechanical engineering , business , metallurgy , oceanography , marketing , geology
Chemical Vapor Deposition (CVD) of diamond films has evolved dramatically in recent years, and commercial opportunities for diamond substrates in thermal management applications are promising. The objective of this technology transfer initiative (TTI) is for Applied Science and Technology, Inc. (ASTEX) and AlliedSignal Federal Manufacturing and Technologies (FM&T) to jointly develop and document the manufacturing processes and procedures required for the fabrication of multichip module circuits using CVD diamond substrates, with the major emphasis of the project concentrating on lapping/polishing prior to metallization. ASTEX would provide diamond films for the study, and FM&T would use its experience in lapping, polishing, and substrate metallization to perform secondary processing on the parts. The primary goal of the project was to establish manufacturing processes that lower the manufacturing cost sufficiently to enable broad commercialization of the technology