Open AccessEVALUATION OF PLATED-THROUGH CONNECTIONS FOR PRINTED CIRCUIT BOARDS
Author(s) -
G. Voida,
Norbert J. Eich
Publication year - 1960
Language(s) - English
Resource type - Reports
DOI - 10.2172/4142146
Subject(s) - printed circuit board , metallizing , copper , materials science , dielectric , engineering drawing , metallurgy , engineering , electrical engineering , computer science , composite material , mechanical engineering , optoelectronics , metal
Concepts of metallizing dielectric surfaces by copper re duction or immersion deposition are discussed. Step-bystep processing techniques for producing quality platedthrough connections are described. A description of the tests performed on the plated-through connections is given (C.J.G.