Electrolytic regeneration of acid cupric chloride printed circuit board etchant. Quarterly report No. 4, April 30, 1996--July 30, 1996 | Zendy

J.E. Oxley | Zendy; R.J. Smialek | Zendy

Open Access

Electrolytic regeneration of acid cupric chloride printed circuit board etchant. Quarterly report No. 4, April 30, 1996--July 30, 1996

Author(s) -

J.E. Oxley,

R.J. Smialek

Publication year - 1996

Publication title -

osti oai (u.s. department of energy office of scientific and technical information)

Language(s) - English

Resource type - Reports

DOI - 10.2172/378168

Subject(s) - membrane , chloride , plating (geology) , printed circuit board , electrolyte , regenerative heat exchanger , materials science , chemistry , engineering , metallurgy , electrical engineering , mechanical engineering , geology , biochemistry , heat exchanger , electrode , geophysics

Tests on T&G Corp. proton selective membranes showed significant ion migration, so no membrane is yet on hand that will allow demonstration of oxygen ingress compensation with the pre-prototype scale regenerator. T&G is remaking a 14118 membrane, the membrane type that was used in successful bench scale testing several years ago. Modifications for pressurized operation of the pre-prototype scale plating cell were successful; the unit can withstand 8 psig pressure without leaking

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