Highlights of the DARPA eletrically conductive adhesive FCA project. Quarterly report, April 1, 1996--June 30, 1996 | Zendy

Ravi F. Saraf | Zendy; J.M. Roldan | Zendy; C.J. Sambucetti | Zendy; Michael Gaynes | Zendy; C. G. Woychik | Zendy; M.K. Snyder | Zendy

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Highlights of the DARPA eletrically conductive adhesive FCA project. Quarterly report, April 1, 1996--June 30, 1996

Author(s) -

Ravi F. Saraf,

J.M. Roldan,

C.J. Sambucetti,

Michael Gaynes,

C. G. Woychik,

M.K. Snyder

Publication year - 1996

Publication title -

osti oai (u.s. department of energy office of scientific and technical information)

Language(s) - English

Resource type - Reports

DOI - 10.2172/266770

Subject(s) - adhesive , reliability (semiconductor) , process development , electrical conductor , composite number , materials science , flip chip , composite material , computer science , engineering , manufacturing engineering , physics , power (physics) , layer (electronics) , quantum mechanics

The accomplishments are broken down into three different categories: materials development (polymer metal composite with increased bond strength), process development (reliability testing, bonding optimization evaluation, testing of bulk conductive adhesives, paste deposition process development), and equipment development (laboratory bonding equipment, cost estimation for flip chip attach methods)

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