Open AccessConverting printed wiring product processing to aqueous processable dry film photoresist. Final report
Author(s) -
S. E. Goldammer
Publication year - 1996
Language(s) - English
Resource type - Reports
DOI - 10.2172/266640
Subject(s) - photoresist , electroplating , materials science , copper plating , dry etching , layer (electronics) , plating (geology) , compatibility (geochemistry) , etching (microfabrication) , nanotechnology , composite material , geophysics , geology
Fully aqueous processable dry film photoresists were evaluated to determine which dry film in the Federal Manufacturing and Technologies printed wiring board facility performed the best. The photoresists were chosen for their compatibility in alkaline etching, copper electroplating, and tin-lead electroplating. The processing evaluation included both single layer and double layer dry film photoresist for pattern plating