Open AccessAppendix to the report from the low-residue soldering task force: Phase 2 results
Author(s) -
Ronald L. Iman,
D.J. Anderson,
D.D. Huffman
Publication year - 1995
Language(s) - English
Resource type - Reports
DOI - 10.2172/183218
Subject(s) - soldering , robustness (evolution) , guideline , computer science , phase (matter) , reliability engineering , engineering , materials science , metallurgy , physics , chemistry , law , biochemistry , quantum mechanics , political science , gene
The LRSTF report for Phase I of its evaluation of low-residue soldering was issued in June 1995. This Appendix summarizes the results of follow-on testing performed in Phase II and compares electrical test results for both phases. Deliberate decisions were made by the LRSTF in Phase I to challenge the design guideline limits in MILSTD-275, Printed Wiring for Electronic Equipment The LRSTF considered this approach to produce a ``worst case`` design and provide useful information about the robustness of LR soldering processes. As such, good design practices were sometimes deliberately violated in designing the LRSTF board. This approach created some anomalies for both LR boards and RMA/cleaned controls. Phase II testing verified that problems that affected both RMA/cleaned and LR boards in Phase I were design related