Electrolytic regeneration of acid cupric chloride printed circuit board etchant. Quarterly report No. 1, July 31, 1995--October 30, 1995 | Zendy

J.E. Oxley | Zendy; R.J. Smialek | Zendy

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Electrolytic regeneration of acid cupric chloride printed circuit board etchant. Quarterly report No. 1, July 31, 1995--October 30, 1995

Author(s) -

J.E. Oxley,

R.J. Smialek

Publication year - 1995

Publication title -

osti oai (u.s. department of energy office of scientific and technical information)

Language(s) - English

Resource type - Reports

DOI - 10.2172/168698

Subject(s) - copper , printed circuit board , separator (oil production) , copper plating , cathode , electrolyte , plating (geology) , chloride , current density , porosity , materials science , metallurgy , graphite , chemistry , composite material , electroplating , electrical engineering , engineering , electrode , physics , layer (electronics) , quantum mechanics , geophysics , geology , thermodynamics

During the quarter we ran tests to determine the effects that key plating parameters have on copper deposit quality. Parameters tested include (a) velocity past the plating cathode, (b) copper concentration in the catholyte from which the copper is plated, (c) plating current density, and (d) catholyte cupric content. The most significant effects were obtained for velocity changes. We also tested porous cell separator materials for hydrophilicity, and evaluated graphite felt activation life from 2 preparation methods

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