Open AccessThermal effects of an advanced wire mesh packaging material
Author(s) -
S.D. Wix,
Jo Pierce
Publication year - 1995
Language(s) - English
Resource type - Reports
DOI - 10.2172/167154
Subject(s) - thermal conductivity , materials science , copper , thermal conduction , polygon mesh , graphite , composite material , buffer (optical fiber) , thermal , percolation (cognitive psychology) , nuclear engineering , metallurgy , thermodynamics , computer science , telecommunications , computer graphics (images) , physics , neuroscience , biology , engineering
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