Thermal Testing and Quality Assurance of BGA LCC & QFN Electronic Packages | Zendy

Cameron Kuper | Zendy

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Thermal Testing and Quality Assurance of BGA LCC & QFN Electronic Packages

Author(s) -

Cameron Kuper

Publication year - 2015

Language(s) - English

Resource type - Reports

DOI - 10.2172/1331501

Subject(s) - soldering , ball grid array , quad flat no leads package , printed circuit board , materials science , surface mount technology , eutectic system , electronic packaging , metallurgy , chip scale package , dip soldering , integrated circuit packaging , conformal coating , coating , wave soldering , composite material , alloy , integrated circuit , engineering , wafer , electrical engineering , optoelectronics , adhesive , layer (electronics)

The purpose of this project is to experimentally validate the thermal fatigue life of solder interconnects for a variety of surface mount electronic packages. Over the years, there has been a significant amount of research and analysis in the fracture of solder joints on printed circuit boards. Solder is important in the mechanical and electronic functionality of the component. It is important throughout the life of the product that the solder remains crack and fracture free. The specific type of solder used in this experiment is a 63Sn37Pb eutectic alloy. Each package was surrounded conformal coating or underfill material.

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