Embedded micromechanical devices for the monolithic integration of MEMS and CMOS | Zendy

James H. Smith | Zendy; Stephen Montague | Zendy; J.J. Sniegowski | Zendy; P. J. McWhorter | Zendy

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Embedded micromechanical devices for the monolithic integration of MEMS and CMOS

Author(s) -

James H. Smith,

Stephen Montague,

J.J. Sniegowski,

P. J. McWhorter

Publication year - 1995

Publication title -

osti oai (u.s. department of energy office of scientific and technical information)

Language(s) - English

Resource type - Reports

DOI - 10.2172/114489

Subject(s) - microelectronics , wafer , microelectromechanical systems , trench , materials science , cmos , fabrication , wafer scale integration , shallow trench isolation , integrated circuit , optoelectronics , electronic engineering , nanotechnology , engineering , layer (electronics) , medicine , alternative medicine , pathology

A flexible, modular manufacturing process for integrating micromechanical and microelectronic devices has been developed. This process embeds the micromechanical devices in an anisotropically etched trench below the surface of the wafer. Prior to microelectronic device fabrication, this trench is refilled with oxide, chemical-mechanically polished, and sealed with a nitride cap in order to embed the micromechanical devices below the surface of the planarized wafer. The feasibility of this technique in a manufacturing environment has been demonstrated by combining a variety of embedded micromechanical structures with a 2 /spl mu/m CMOS process on 6 inch wafers. A yield of 78% has been achieved on the first devices manufactured using this technique.

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