Open AccessReaction Between Thin Gold Wires And Pb-Sn-In Solder (37.5%, 37.5%, 25%), Part C. A Comprehensive Model Of The Reaction Inside The Solder Mounds In Both The Interface Controlled Regime And The Diffusion-Controlled Regime.
Author(s) -
W. J. Siekhaus
Publication year - 2012
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/1084719
Subject(s) - soldering , materials science , indium , gold alloys , metallurgy , alloy
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