Geometric Summary of the 9 Chip Ladder for the D0 Silicon Tracker
Author(s) -
Paul M. Ratzmann,
W. E. Cooper,
D. Goloskie,
J. Kowalski,
R. Lipton,
P. A. Rapidis,
C. Serritella
Publication year - 1997
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/1032128
Subject(s) - chip , chamfer (geometry) , mathematics , computer science , geometry , engineering drawing , engineering , telecommunications
Two hybrids types are required to accomodate the flipping of ladders within each bulkhead layer, in order to account for the pigtail routing. Left and right versions are shown below, following the definitions laid out by Mike Matulik. These drawings are not to proper scale in the sketches below. The dimensionally correct versions of the 9 chip hybrids are stored in DCS under drawing number 3823.112-MD-317803 for the lefthanded version, and 3823.112-MD-317804 for the right handed version. Handedness of the hybrids are designated as shown in the figures and table below. There are long and short versions of both the left and the right, for four total 9 chip hdi designs. The pigtail lengths of the long and short are shown in a table in the hybrid drawings which reside in DCS. The chamfer in the hybrid corners (N side) is placed in order to enable the hybrid to be glued to the beryllium substrate, whereas the rectangular cuttout on the same side is to allow direct gluing of a temperature sensor to the substrate metal. The oblong shape on the N side of both hybrids is a 'stay-clear' region (defined in the final drawings) where pressure will be applied to the hybrid during the second stage of ladder construction
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