Open AccessKinetics of the wetting of tin on air-passivated copper in the absence of a fluxing agent
Author(s) -
D.E. Peebles,
H.C. Peebles,
James Anthony Ohlhausen,
F.G. Yost
Publication year - 1994
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/10196608
Subject(s) - wetting , copper , tin , soldering , materials science , analytical chemistry (journal) , metallurgy , isothermal process , x ray photoelectron spectroscopy , sputtering , substrate (aquarium) , composite material , chemical engineering , chemistry , thin film , nanotechnology , physics , oceanography , chromatography , geology , engineering , thermodynamics
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom