Open AccessEvaluation of no-clean solder process designed to eliminate the use of ozone-depleting chemicals
Author(s) -
Mark T. Paffett,
John Farr,
Yvonne Rogers,
W.B. Hutchinson
Publication year - 1993
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Reports
DOI - 10.2172/10191804
Subject(s) - soldering , rosin , process engineering , surface mount technology , solder paste , materials science , environmental science , computer science , engineering , metallurgy , chemical engineering , resin acid
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