Open AccessProcess characterization and control of hand-soldered printed wiring assemblies
Author(s) -
D.L. Cheray,
R.G. Mandl
Publication year - 1993
Language(s) - English
Resource type - Reports
DOI - 10.2172/10185352
Subject(s) - soldering , dip soldering , component (thermodynamics) , joint (building) , characterization (materials science) , process (computing) , materials science , engineering drawing , flux (metallurgy) , printed circuit board , wave soldering , quality (philosophy) , mechanical engineering , manufacturing engineering , engineering , composite material , metallurgy , computer science , structural engineering , electrical engineering , nanotechnology , operating system , philosophy , physics , epistemology , thermodynamics