Open AccessHigh accuracy die mechanical stress measurement with the ATC04 Assembly Test Chip
Author(s) -
J.N. Sweet,
D.W. Peterson
Publication year - 1993
Language(s) - English
Resource type - Reports
DOI - 10.2172/10181996
Subject(s) - die (integrated circuit) , soldering , flip chip , chip , stress (linguistics) , materials science , constitutive equation , structural engineering , mechanical engineering , engineering drawing , engineering , composite material , electrical engineering , finite element method , linguistics , philosophy , adhesive , layer (electronics)
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom